ASIC Design & Test Services
Custom Mixed-Signal IC Solutions by MicroVision.
MicroVision delivers advanced ASIC design and test services for imaging, LiDAR, and sensor applications. With decades of experience and over 300 custom designs, our team provides high-performance, application-specific solutions - from concept through production.
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Why Custom ASIC Design and why MicroVision?
Custom ASICs enable optimized system performance while reducing overall cost and complexity.
- Lower system cost through integration
- Reduced board size, weight, and part count
- Simplified qualification and supply chain
- Tailored performance for specific applications
- Streamlined bill of materials (BoM)
Why MicroVision?
Our ASIC team combines deep expertise with agility and accessibility.
- Highly skilled analog and mixed-signal design engineers
- Cost-effective compared to large design firms
- Flexible support for both low- and high-volume programs
- Direct access to engineers and rapid response times
- U.S.-based team with fast, iterative development cycles
Core Capabilities
Mixed-Signal ASIC Design
- Pixel-oriented IC architectures
- Imaging, LiDAR, and sensor-focused designs
- Analog and digital integration using industry-standard tools (Cadence, Synopsys, Mentor)
Design & Test Services
- First-article verification in fully equipped test labs
- Optical and electrical validation capabilities
- Established vendor ecosystem for scalable production
Proven Track Record
- 300+ custom ASIC designs delivered
- 30+ years of combined design experience
- Applications spanning X-ray, LWIR, LiDAR, and imaging system
Application Experience
Broad expertise across industries and sensing modalities:
- Imaging ASICs (1D & 2D arrays, monochrome systems)
- LiDAR and time-of-flight sensing
- Display and spatial light modulators (LCOS)
- Automotive-qualified designs (AEC-Q100)
- Radiation-hardened environments
Example:
- ASIC development for MicroVision’s Iris LiDAR sensor platform
Technology & Process Expertise
Manufacturing & Foundries
- CMOS nodes: 180nm, 130nm, 65nm
- Experience with TSMC, Tower Semiconductor, and X-FAB
Advanced Capabilities
- Cryogenic operation (down to 40K)
- Reticle stitching for large arrays
- High-speed analog and RF front-end design
Integrated IP
- On-chip ADC (up to 20-bit resolution)
- Time-to-digital conversion (250ps resolution)
- High-bandwidth analog front ends (up to 10GHz)
- Multiple digital interfaces: SPI, SERDES, CameraLink
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We look forward to hearing from you