Custom Silicon. Engineered for What's Next.
High-performance mixed-signal ASIC design for advanced imaging, lidar, and sensing applications.
When off-the-shelf technology can't meet your requirements, custom silicon can unlock what's possible.
From initial concept to production-ready designs, we engineer silicon around your application, not the other way around.
MicroVision Semiconductor Inc. (MSI) delivers specialized ASIC design, verification, and test services that help companies achieve demanding performance objectives, simplify system architectures, and bring innovative sensing technologies to market.
Backed by more than 300 completed custom ASIC designs and decades of engineering expertise, our U.S.-based team combines deep analog and mixed-signal capabilities with the agility, accessibility, and responsiveness of a dedicated engineering partner.
The Advantage of Custom ASIC Design
Greater Performance. Less Complexity. Built for Your Requirements.
Advanced sensing systems often demand more performance than standard components can deliver. Performance requirements, power constraints, size limitations, and cost targets often require a more integrated approach.
Custom ASICs bring critical functionality together in silicon engineered specifically for your application, improving system efficiency, reducing complexity, and creating a more scalable path to production.
Performance Without Compromise
Optimize critical functions around your specific speed, precision, power, and sensing requirements.
Smaller, Simpler Systems
Consolidate functionality, reduce component count, and minimize board space, weight, and integration complexity.
Lower Total System Cost
Streamline your bill of materials and reduce system-level costs through greater integration.
Simplified Manufacturing & Qualification
Reduce component dependencies and simplify qualification, sourcing, and production planning.
Our Capabilities
Specialized Expertise. From Design Through Validation.
MSI delivers the engineering capabilities needed to turn complex requirements into high-performance, application-specific silicon. Our team supports the development lifecycle from architecture and circuit design through verification, testing, and production support.
Layout plot
Mixed-Signal ASIC Design
High-performance analog and digital circuitry for RF, memory, lidar, and imaging, including pixel-oriented IC architectures.
Die on test board
Design Verification & Testing
Comprehensive first-article verification, including optical and electrical validation in a modern laboratory test environment. Full characterization, debug, and system integration capabilities on site.
Production die
Foundry & Production Support
Extensive experience across 180 nm, 130 nm, and 65 nm CMOS process technologies, with an established vendor ecosystem and experience working with TSMC, Tower Semiconductor, and X-FAB to support scalable manufacturing.
Advanced Technology Expertise
Engineered for Complex Challenges.
From high-speed signal processing to extreme operating environments, MSI brings specialized design expertise to applications where precision, performance, and reliability are critical.
Our engineering experience spans specialized detector architectures, advanced pixel arrays, and sensing applications across wavelengths from gamma radiation to long-wave infrared.
| Technology | Capabilities |
|---|---|
| Analog-to-digital conversion | Integrated ADCs with up to 20-bit resolution |
| Time-to-digital conversion | Precision timing resolution down to 80 ps |
| High-speed analog & RF | Analog front-end design up to 10 GHz |
| Digital interfaces | SPI, SERDES, and CameraLink |
| CMOS process technologies | 180 nm, 130 nm, and 65 nm |
| Cryogenic operation | Design experience down to 40 K |
| Large-format arrays | Reticle stitching for extended array architectures |
| Automotive applications | AEC-Q100-qualified designs |
Applications & Industries
Purpose-Built Silicon for Advanced Sensing.
From industrial imaging to next-generation perception systems, MSI develops custom ASIC solutions for applications where conventional components cannot fully address system requirements.
APD readout ASIC
Lidar & Time-of-Flight Sensing
Precision timing, ranging, and signal-processing architectures for advanced lidar and perception systems.
Advanced Imaging & Detection
1D and 2D arrays, supporting hybridization and a wide array of detection technologies.
APD readout ASIC
Detector array
Optical & Photonic Systems
High-speed data and signal integrity, memory design and test, and RF front ends.
Mission-Critical Applications
Design experience supporting automotive-qualified, radiation-hardened, and cryogenic applications with demanding environmental requirements.
Packaged die on carrier
Proven Engineering Experience
Custom ASIC designs completed
Years in the chip design business
Cryogenic operating experience
Proven in Advanced Lidar Technology
Real-World Experience. System-Level Perspective.
MSI's engineering expertise extends beyond circuit design to the complex requirements of advanced sensing systems.
Our team's ASIC development experience includes supporting MicroVision's IRIS™ long-range lidar platform, connecting specialized semiconductor design with the real-world demands of high-performance perception technology.
That system-level understanding helps our engineers anticipate integration challenges, optimize designs for intended applications, and develop solutions that perform beyond the laboratory.
Lidar ASIC, wire-bonded
Why MicroVision Semiconductor?
Deep Technical Expertise. The Agility to Move Faster.
The right ASIC development partner brings more than engineering capability. They bring the experience to solve difficult challenges, the responsiveness to keep programs moving, and the commitment to understand what success means for your application.
MSI combines specialized semiconductor expertise with a collaborative, customer-focused approach.
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Experienced Engineers, Direct Access
Work directly with highly skilled analog and mixed-signal engineers who understand the technical challenges behind your design.
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Agile, Responsive Development
Benefit from a U.S.-based engineering team, rapid communication, and iterative development cycles that keep projects moving.
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Flexible Engagement
Support tailored to your requirements, from specialized design services to complete ASIC development programs, across low- and high-volume applications.
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Cost-Effective Expertise
Access advanced semiconductor design capabilities with the efficiency and flexibility of a specialized engineering team.
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Built for Real-World Results
Combine deep circuit-level expertise with practical understanding of system integration, testing, and production requirements.
Our goal isn't simply to deliver a chip. It's to help you build a better-performing system.
Our Heritage
Proven Expertise. Expanded Possibilities.
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Origin
Black Forest Engineering
MicroVision Semiconductor Inc. builds on the established engineering heritage of Black Forest Engineering, whose assets were acquired by MicroVision in February 2026.
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February 2026
Joined MicroVision
This combination brings decades of specialized ASIC design experience together with MicroVision's expertise in advanced lidar, perception, and sensing technologies.
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Today
MicroVision Semiconductor Inc.
Today, MSI serves customers seeking custom semiconductor solutions across imaging, industrial, automotive, security, defense, and other advanced sensing applications, backed by proven engineering capabilities and a commitment to solving complex technical challenges.
Let's Engineer What's Next.
Your Application Is Unique. Your Silicon Should Be Too.
Whether you're developing a next-generation sensing platform, improving an existing architecture, or exploring the advantages of custom silicon, MSI can help translate your requirements into a high-performance ASIC solution.
Connect with our engineering team to discuss your design challenges, technical requirements, and development goals.